Borra, M. Z. Et Al. 2019. Slicing crystalline silicon wafer by deep subsurface laser processing and selective chemical etching. 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019 , (Munich, Germany).

Borra, M. Z., Nasser, H., Çiftpınar, E. H., Turnali, A., Deminskyi, P., Çolakoğlu, T., ... Tokel, O.(2019). Slicing crystalline silicon wafer by deep subsurface laser processing and selective chemical etching . 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019, Munich, Germany

Borra, Mona Et Al. "Slicing crystalline silicon wafer by deep subsurface laser processing and selective chemical etching," 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019, Munich, Germany, 2019

Borra, Mona Z. Et Al. "Slicing crystalline silicon wafer by deep subsurface laser processing and selective chemical etching." 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019 , Munich, Germany, 2019

Borra, M. Z. Et Al. (2019) . "Slicing crystalline silicon wafer by deep subsurface laser processing and selective chemical etching." 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019 , Munich, Germany.

@conferencepaper{conferencepaper, author={Mona Zolfaghari Borra Et Al. }, title={Slicing crystalline silicon wafer by deep subsurface laser processing and selective chemical etching}, congress name={2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019}, city={Munich}, country={Germany}, year={2019}}