DAŞKAPAN, T. And ÇİÇEK, S. 2017. The effect of ligand, as additive, on the electrophilic amination of arylcopper reagents. 3rd International Turkic World Conference on Chemical Sciences and Technologies (ITWCCST 2017) , (Baku, Azerbaijan).

DAŞKAPAN, T., & ÇİÇEK, S., (2017). The effect of ligand, as additive, on the electrophilic amination of arylcopper reagents . 3rd International Turkic World Conference on Chemical Sciences and Technologies (ITWCCST 2017), Baku, Azerbaijan

DAŞKAPAN, TAHİR, And SEMRA ÇİÇEK. "The effect of ligand, as additive, on the electrophilic amination of arylcopper reagents," 3rd International Turkic World Conference on Chemical Sciences and Technologies (ITWCCST 2017), Baku, Azerbaijan, 2017

DAŞKAPAN, TAHİR And ÇİÇEK, SEMRA. "The effect of ligand, as additive, on the electrophilic amination of arylcopper reagents." 3rd International Turkic World Conference on Chemical Sciences and Technologies (ITWCCST 2017) , Baku, Azerbaijan, 2017

DAŞKAPAN, T. And ÇİÇEK, S. (2017) . "The effect of ligand, as additive, on the electrophilic amination of arylcopper reagents." 3rd International Turkic World Conference on Chemical Sciences and Technologies (ITWCCST 2017) , Baku, Azerbaijan.

@conferencepaper{conferencepaper, author={TAHİR DAŞKAPAN And author={SEMRA ÇİÇEK}, title={The effect of ligand, as additive, on the electrophilic amination of arylcopper reagents}, congress name={3rd International Turkic World Conference on Chemical Sciences and Technologies (ITWCCST 2017)}, city={Baku}, country={Azerbaijan}, year={2017}}